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A. Lead-containing tin-spraying flux series |
Model |
Name |
Appearance |
Specific Gravity
(20℃) |
Purpose |
HAR-996A |
Flux |
Colorless to light yellow transparent liquid |
1.10±0.05 |
Vertical tin-spraying, economical, low-cost, relatively large fume volume; applicable to general PCB |
HAR-996B |
Flux |
Colorless to light yellow transparent liquid |
1.16±0.05 |
Vertical tin-spraying, little tin slag on surface and tin-spraying furnace; particularly applicable to boards with dense IC lines |
HAR-809LD |
Flux |
Colorless to light yellow transparent liquid |
1.05±0.05 |
Vertical tin-spraying, good tin-spraying performance; little copper exposure; particularly applicable to boards which cannot be tinned easily |
HAR-809C |
Flux |
Colorless to light yellow transparent liquid |
1.10±0.05 |
Vertical tin-spraying, general type; applicable to manufacturing of single/double-sided and multi-layer boards |
HAR-809D |
Flux |
Colorless to light yellow transparent liquid |
1.05±0.05 |
Vertical tin-spraying, good tin-spraying performance; little copper exposure; particularly applicable to boards which cannot be tinned easily |
HAR-809E |
Flux |
Colorless to light yellow transparent liquid |
1.16±0.05 |
Vertical tin-spraying, little tin slag on surface and tin-spraying furnace; particularly applicable to boards with dense IC lines |
HAR-809F |
Flux |
Colorless to light yellow transparent liquid |
1.09±0.05 |
Vertical tin-spraying; little ash on surface; easy cleaning; particularly applicable to single-sided boards made with certain materials |
HAR-809FS |
Flux |
Colorless to light yellow transparent liquid |
1.13±0.05 |
Vertical tin-spraying; easily cleaning; applicable to difficult-to-clean boards or some single-sided boards |
HAR-809G |
Flux |
Colorless to light yellow transparent liquid |
1.02±0.05 |
Horizontal tin-spraying; little copper exposure; easy cleaning; high output; used with oxidation prevention oil |
HAR-809H |
Flux |
Colorless to light yellow transparent liquid |
1.12±0.05 |
Vertical tin-spraying; no halogen; easy cleaning; low degree of ion pollution |
HAR-810 |
Pre-coated flux |
Dark amber transparent liquid |
0.835±0.05 |
Pre-coating of single-sided exposed copper board to prevent oxidation |
HAR-811 |
Pre-coated flux |
Dark amber transparent liquid |
0.845±0.05 |
Pre-coating of single-sided exposed copper board to prevent oxidation |
HAR-8090 |
High-temperature oil |
Adhesive transparent liquid |
1.25±0.05 |
Soluble in water; little fume, high oxidation resistance, large tolerance of impurities, long service life, less tin slag and long service life of tin-spraying furnace |
HAR-8099 |
High-temperature oil |
Adhesive transparent liquid |
1.10±0.05 |
Soluble in water and solvents; less fume, good stability and low toxicity; direct discharge of waste water, significant reduction of tin slag on tin-spraying furnace and board surface, increase of the brightness of soldering points and prolonging of the service life of the tin-spraying furnace |
HAR-8099A |
High-temperature oil |
Adhesive transparent liquid |
1.10±0.05 |
Soluble in water and solvents; less fume, good stability and low toxicity; direct discharge of waste water, significant reduction of tin slag on tin-spraying furnace and board surface, increase of the brightness of soldering points and prolonging of the service life of the tin-spraying furnace |
B. Lead-free tin-spraying flux series: |
Model |
Name |
Appearance |
Specific Gravity
(20℃)
|
Purpose |
HAR-809K |
Lead-free flux |
Colorless to light blue transparent liquid |
1.12±0.05 |
Vertical tin-spraying; general and economical type; applicable to boards with dense IC lines |
HAR-809KS |
Lead-free flux |
Colorless to light blue transparent liquid |
1.10±0.05 |
Vertical tin-spraying; easy cleaning; and applicable to ceratin single-sided boards |
HAR-809KA |
Lead-free flux |
Colorless to light blue transparent liquid |
1.10±0.05 |
Vertical tin-spraying; little fume and odor; environmentally friendly; good tinning performance; little copper exposure |
HAR-809HK |
Lead-free flux |
Colorless to light blue transparent liquid |
1.10±0.05 |
Vertical tin-spraying;no halogen, easy cleaning and low degree of ion pollution |
HAR-809GK |
Lead-free flux |
Colorless to light blue transparent liquid |
1.05±0.05 |
Horizontal tin-spraying, easy cleaning, good tinning performance, high output and low individual consumption |
HAR-809GHK |
Lead-free flux |
Colorless to light blue transparent liquid |
1.10±0.05 |
Horizontal tin-spraying;no halogen, easy cleaning and low degree of ion pollution |
HAR-809BGA |
Lead-free flux |
Colorless to light blue transparent liquid |
1.05±0.05 |
Vertical tin-spraying; good tinning performance; and applicable to board surfaces which cannot be tinned easily in the BGA position |
HAR-809BGAS |
Lead-free flux |
Colorless to light blue transparent liquid |
1.05±0.05 |
Vertical tin-spraying; applicable to boards which cannot be tinned easily in the BGA and character position; but relatively high unit price |
C. Antioxidant (OSP) series |
Model |
Name |
Appearance |
Characteristic & Process Conditions |
HAROSP-812 |
Antioxidant |
Light blue transparent liquid |
Economical product; particularly applicable single-sided board; low cost of unit area.
PH: 2.9-3.2; temperature: 38℃-40℃; time: 30-90s; strength: 90-110% |
HAROSP-812AD |
Supplement |
Light blue transparent liquid |
When the strength of HAROSP-812 bath solution decreases to less than 90%, add it |
HAROSP-812SA |
Acidity regulator |
Colorless transparent liquid |
When the PH value or acidity of HAROSP-812 bath solution exceeds the range, add it for adjustment |
HAROSP-812AC |
Accelerant |
Light yellow transparent liquid |
It is used in the HAROSP-812 process and added when the film is not thick enough or the film forming is slow |
HAROSP-209A |
Degreasing agent |
Colorless transparent liquid |
Used in various antioxidant processes.
Slot: 2-5%; sulfuric acid: 5-10%; temperature: 45-50℃; time: 30-60s |
HAROSP-SPS |
Micro etchant |
White powder solid |
Used in various antioxidant processes and ammonium persulfate systems.
Slot: 80-150g/L; sulfuric acid: 2-4%; temperature: 30-35℃; time: 30-60s |
HAROSP-WA |
Micro etchant |
Colorless transparent liquid |
Used in various antioxidant processes and hydrogen peroxide systems.
Slot: 30-60%; temperature: 25-35℃; time: 30-60s; micro etching depth: 1.5-2.5μm; copper ion content: 5-30 g/L |
HAROSP-106HT |
Antioxidant |
Light blue transparent liquid |
Resistant to high temperature several times; and applicable to double-sided and multi-layer boards.
PH: 3.4-3.6; temperature: 35-45℃; time: 30-90s; strength: 90-110% |
HAROSP-106AD |
Supplement |
Light blue transparent liquid |
When the strength of HAROSP-106HT bath solution is less than 90%, add it |
HAROSP-106SA |
Acidity regulator |
Colorless transparent liquid |
When the acidity value of HAROSP-106HT bath solution is less than 240 or the PH value is more than 3.6, add it for adjustment |
HAROSP-106AC |
Accelerant |
Light yellow transparent liquid |
Used in the HAROSP-106HT process, and added when the film is not thick enough or the film forming is slow |
HAROSP-108HT |
Antioxidant |
Baby blue transparent solution |
Withstand at least 3 lead-free soldering and wave soldering cycles, with excellent solderability. Suitable for electrical boards, communication boards, computer motherboards, etc. 38-42 ℃, 45-90 seconds, pH=3.20-3.50, concentration 90-130% |
HAROSP-108AD |
Concentrate |
Colorless to light yellow transparent solution |
Add this supplement when the concentration of the tank solution is below 90% |
HAR-9010 |
Degreaser |
Colorless transparent solution |
Remove organic dirt (light oil), fingerprints, and oxide film from the surface of the PCB board. 30-40 ℃, 30-60 seconds, concentration 5-10% |
HAR-9020A |
Micro corrosion stabilizer |
Colorless transparent solution |
Inhibiting the rapid decomposition of hydrogen peroxide, temperature micro corrosion rate, and cleaning the copper surface. 28-32 ℃, 30-60 seconds, concentration 2-5% |
HAROSP-F2 |
Antioxidant |
Colorless to light yellow transparent liquid |
Resistant to high temperature and particularly applicable to gold-coated circuit boards subject to direct treatment.
Requiring no tape, etc. to protect gold surfaces, and avoiding color change and film formation on the gold surface.
PH: 3.7-4.0; temperature: 38-42℃; time: 60-90s; strength: 90-110%; film thickness: 0.15-0.30μm |
HAROSP-F2AC |
Accelerant |
Light yellow transparent liquid |
Used in the HAROSP-F2 process, and added when the film forming is slow or the film is not thick enough |
HAROSP-F2SA |
Acidity regulator |
Colorless transparent liquid |
When the PH value or acidity of HAROSP-812 bath solution exceeds the range, add it for adjustment |
HAROSP-500 |
Supplement |
Light yellow to brown transparent liquid |
When the strength of HAROSP-F2 bath solution is less than 90%, add it.
PH: 2.5-3.5; specific gravity: 1.05±0.05 (20℃) |
D. Chemical tin series products |
Model |
Name |
Appearance |
Specific Gravity
(20℃)
|
Operating Conditions |
HAR-209A7 |
Acidic degreasing agent |
Colorless transparent liquid |
1.05±0.05 |
Vertical: 2-3min, 30℃-40℃;
Horizontal: 90-120sec, 30℃-40℃
|
HAR-WA7 |
Micro ethant |
Colorless to blue transparent liquid |
1.15±0.05 |
Vertical: 1-2min, 30℃-40℃;
Horizontal: 30-60sec, 30℃-40℃
|
HAR-7000 |
Pre-dipping agent |
Colorless transparent liquid |
1.05±0.05 |
Vertical: 60-90sec, room temperature to 40℃;
Horizontal: 30-60sec, room temperature to 40℃ |
HAR-7001 |
Pre-dipping agent |
Colorless transparent liquid |
1.05±0.05 |
Vertical: 60-90sec, 30℃-40℃;
Horizontal: 45-60sec, 30℃-40℃
|
HAR-7004 |
Main tinning agent |
Colorless to light yellow transparent liquid |
1.20±0.05 |
Vertical: 10-20min, 60℃-70℃;
Horizontal: 8-12min, 60℃-70℃
|
E. Chemical silver series products |
Model |
Name |
Process Conditions
|
HAR-209A8 |
Acidic degreasing agent |
Slot: HAR-209A8: 2-5%; H2SO4: 5-10%, remaining water; horizontal process: 50℃, 30s;
Vertical process: 50℃, 5min |
HAR-WA8 |
Micro ethant |
Slot: HAR-WA8: 30-70%; remaining water; horizontal process: 32℃, 60s;
Vertical process: 32℃, 60s
|
HAR-78A |
Pre-dipping agent |
Horizontal process: 25-35℃, 30-90s; vertical process: 25-35℃, 60-90s |
HAR-78B |
Main silveragent |
Horizontal process: 50-60℃, 120-240s; vertical process: 50-60℃, 180-300s |
HAR-78C |
Anti-tarnish agent |
Horizontal process: 30-50℃, 60-120s; vertical process: 30-50℃, 90-150s |
F. Chemical nickel series products
|
Model |
Name |
Properties & Process Conditions |
HAR-209A9 |
Acidic degreasing agent |
Slot: 100ml/L, remaining water; temperature: 35-45℃; time: 3-5mim |
HAR-7900M |
Active cylinder-opening agent |
Slot: HAR-7900M: 100ml/L, remaining water; temperature: 25-30℃; time: 1-3mim (depending on the specific situation) |
HAR-7900R |
Active additive |
HAR-7955A |
Main chemical nickel agent A |
Slot: HAR-7955M: 150ml/L; HAR-7955A: 50ml/L; HAR-7955D: 5ml/L; remaining water.
Temperature: 78-85℃; PH: 4.4-4.8; time: 15-30min (depending on the specific situation)
|
HAR-7955B |
Main chemical nickel agent B |
HAR-7955C |
Main chemical nickel agent C |
HAR-7955D |
Main chemical nickel agent D |
HAR-7955M |
Main chemical nickel agent M |
HAR-7987 |
Main chemical thin gold agent |
Slot: 100ml/L; temperature: 83-90℃; PH: 4.8-6.0; time: depending on the specific situation |
HAR-7988 |
Main chemical thick gold agent |
Slot: 170ml/L; temperature: 88-95℃; PH: 5.0-6.0; time: depending on the specific situation |
|
G. Horizontal through hole series (I) |
Model |
Name |
Properties & Process Conditions |
HAR-6910A |
Hole conditioning agent |
Slot: HAR-6910A: 1-3%; sodium carbonate: 0.5g/L. Horizontal process: temperature: 50-60℃; processing time: 40s |
HAR-6910B |
Hole conditioning agent |
Slot: HAR-6910B: 1-3%; sodium carbonate: 0.5g/L. Horizontal process: temperature: 50-60℃; processing time: 40s |
HAR-6920 |
Oxidant |
Slot: HAR-6920: 10-12%. Horizontal process: temperature: 85-90℃; processing time: 60s |
HAR-6930A |
Catalyst |
Slot: HAR-6930A: 1-2%. Horizontal process: temperature: 18-20℃; processing time: 100s |
HAR-6930B |
Catalyst |
Slot: HAR-6930B: 1-2%. Horizontal process: temperature: 18-20℃; processing time: 100s |
HAR-6930C |
Catalyst |
Slot: HAR-6930C: 0.5-1%. Horizontal process: temperature: 18-20℃; processing time: 100s |
|
H. Horizontal through hole series (II) |
Model |
Name |
Properties & Process Conditions |
HAR-6911A |
Hole conditioning agent |
Slot: HAR-6911A: 1-3%; sodium carbonate: 0.5g/L. Horizontal process: temperature: 50-60℃; processing time: 40s |
HAR-6911B |
Hole conditioning agent |
Slot: HAR-6911B: 1-3%; sodium carbonate: 0.5g/L. Horizontal process: temperature: 50-60℃; processing time: 40s |
HAR-6921 |
Oxidant |
Slot: HAR-6921: 12%. Horizontal process: temperature: 85-90℃; processing time: 60s |
HAR-6931A |
Catalyst |
Slot: HAR-6931A: 1-2%. Horizontal process: temperature: 18-20℃; processing time: 100s |
HAR-6931B |
Catalyst |
Slot: HAR-6931B: 1-2%. Horizontal process: temperature: 18-20℃; processing time: 100s |
HAR-6931C |
Catalyst |
Slot: HAR-6930C: 0.5-1%. Horizontal process: temperature: 18-20℃; processing time: 100s |
I. Ion pollutant cleaning agent series products
Model |
Name |
Nature |
Specific Gravity
(20℃)
|
Properties & Process Conditions |
HAR-905A |
Cleaning agent |
Colorless transparent liquid |
0.98±0.10 |
Used in treatment process after tin-spraying and other final surface treatment. No bubble and high deionizing capability |
HAR-906A |
Cleaning agent |
Colorless transparent liquid |
1.02±0.10 |
Used in treatment process after tin-spraying and other final surface treatment, to effectively reduce the degree of ion pollution |
HAR-907A |
Cleaning agent |
Colorless to yellow transparent liquid |
1.00±0.10 |
Used for ion cleaning after tin-spraying and other final surface treatment. Small quantities of bubbles and good cleaning effects.
Used with the ultrasonic leaning line |
HAR-908A |
Cleaning agent |
Colorless to yellow transparent liquid |
1.01±0.10 |
Used for ion pollutant cleaning after tin-spraying and other final surface treatment, to quickly and effectively reduce the concentration of ion pollutants on the board surface to less than 0.5ug/cm2.
Used with the ultrasonic leaning line |
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