China Harvar Group will participate in the 12th East China Circuit Board and Surface Attachment Exhibition held at the Suzhou International Expo Center on 18-20 May , 2016. Exhibition No.: D1 Hall AX3.
The highlights of this exhibition are: main push direct electroplating(horizontal through hole, organic conductive film) process
Direct electroplating(horizontal through hole, organic conductive film) process is to use polymer organic matter as the conductive medium for the through hole, providing a conductive basis for subsequent electroplating of thickened copper. This process does not use the carcinogen formaldehyde, in which the polymer conductivity is only deposited in the PCB substrate part, does not react with the copper surface, the plate surface is clean, which is conducive to the quality of the post-process, and the consumption of the solution is low. In the chemical reaction, no hydrogen and other gases are produced, and the production of copper in the hole can be eliminated. The production of supporting horizontal equipment can be easily controlled and maintained, and the efficacy and quality can be effectively improved. The quality can fully meet the IPC 600 standard.

As well as adhesive paper tape, alkaline silver, nickel Carbide, OSP, chemical tin, flux, medium coarse and other PCB series electronic chemicals and human health products, targeted anticancer drugs.